| #2037750 in Books | Wu Banqiu Kumar | 2011-07-28 | Original language:English | PDF # 1 | 9.30 x.91 x6.30l,1.70 | File Name: 007174195X | 544 pages | 3D IC Stacking Technology
||3 of 3 people found the following review helpful.| 3D IC Stacking Technology - Book Review|By Zvi Or-Bach|3D IC Stacking Technology - Book Review
We really enjoyed reading the 3D-IC book. Below is feedback from our review: * Excellent book, gives great understanding of process parameters of 3D-TSV technology. Easily the best book we have seen on the subject. * The book provides the foundation technology fo|About the Author||Banqiu Wu is Chief Technology Officer, TSV and Mask Products Business Group, Applied Materials, Inc. Dr. Wu has published over 50 technological papers in 10 peer-reviewed journals and conference proceedings, and authored/co-authored sev
The latest advances in three-dimensional integrated circuit stacking technology
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are als...
[PDF.pk06] 3D IC Stacking Technology Rating: 3.80 (644 Votes)
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You can specify the type of files you want, for your gadget.3D IC Stacking Technology | Banqiu Wu, Ajay Kumar PhD, Sesh Ramaswami. I have read it a couple of times and even shared with my family members. Really good. Couldnt put it down.
