[Get free] Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
♥ Sheng Liu, Yong Liu ♥
| #3056331 in Books | 2011-05-17 | Original language:English | PDF # 1 | 9.90 x1.40 x6.90l,2.50 | File Name: 0470827807 | 576 pages
||0 of 1 people found the following review helpful.| Four Stars|By Jun Lu|good books with details.|From the Back Cover|Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution.
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulati...
[PDF.wa15] Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing Rating: 3.75 (600 Votes)
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You can specify the type of files you want, for your gadget.Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing | Sheng Liu, Yong Liu. I was recommended this book by a dear friend of mine.
