(Read ebook) Through-Silicon Vias for 3D Integration
✿ Dr John H. Lau ✿
| #2165627 in Books | McGraw-Hill Professional | 2012-10-11 | Original language:English | PDF # 1 | 9.30 x.90 x6.30l,1.50 | File Name: 0071785140 | 512 pages |
||About the Author||John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, I
A comprehensive guide to TSV and other enabling technologies for 3D integration
Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-fa...
[PDF.xu87] Through-Silicon Vias for 3D Integration Rating: 3.84 (640 Votes)
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You easily download any file type for your gadget.Through-Silicon Vias for 3D Integration | Dr John H. Lau. I have read it a couple of times and even shared with my family members. Really good. Couldnt put it down.
