(Download) Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
☆ Shichun Qu, Yong Liu ☆
| #2495404 in Books | Shichun Qu Yong Liu | 2014-09-11 | Original language:English | PDF # 1 | 9.21 x.81 x6.14l,.0 | File Name: 149391555X | 322 pages | Wafer Level Chip Scale Packaging Analog and Power Semiconductor Applications
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliabili...
[PDF.it26] Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Rating: 3.83 (469 Votes)
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